“Molecular Copper Decomposition ink for Printable Electronics” is accepted in Chemical Communications, July 21, 2022.“Molecular Copper Decomposition ink for Printable Electronics” is accepted in Chemical Communications, July 21, 2022. July 22, 2022July 22, 2022| 0 Comment| 2:14 am Read MoreRead More
“Manufacturing Silica Aerogel and Cryogel through Ambient Pressure and Freeze Drying” is accepted in RSC Advances, July 21, 2022.“Manufacturing Silica Aerogel and Cryogel through Ambient Pressure and Freeze Drying” is accepted in RSC Advances, July 21, 2022. July 22, 2022July 22, 2022| 0 Comment| 2:13 am Read MoreRead More
“Tailoring thermalinsulation architectures from additive manufacturing” is accepted in Nature Communications, July 20, 2022.“Tailoring thermalinsulation architectures from additive manufacturing” is accepted in Nature Communications, July 20, 2022. July 22, 2022July 22, 2022| 0 Comment| 2:13 am Read MoreRead More
“Low-power anisotropic molecular electronic memristors” is accepted in Applied Materials Today, June 17, 2022.“Low-power anisotropic molecular electronic memristors” is accepted in Applied Materials Today, June 17, 2022. July 22, 2022July 22, 2022| 0 Comment| 2:13 am Read MoreRead More
“Switching charge states in quasi-2D molecular conductors” is published in PNAS Nexus, June 13, 2022.“Switching charge states in quasi-2D molecular conductors” is published in PNAS Nexus, June 13, 2022. July 22, 2022July 22, 2022| 0 Comment| 2:12 am Read MoreRead More