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Day: July 22, 2022

“Molecular Copper Decomposition ink for Printable Electronics” is accepted in Chemical Communications, July 21, 2022.“Molecular Copper Decomposition ink for Printable Electronics” is accepted in Chemical Communications, July 21, 2022.

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“Manufacturing Silica Aerogel and Cryogel through Ambient Pressure and Freeze Drying” is accepted in RSC Advances, July 21, 2022.“Manufacturing Silica Aerogel and Cryogel through Ambient Pressure and Freeze Drying” is accepted in RSC Advances, July 21, 2022.

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“Tailoring thermalinsulation architectures from additive manufacturing” is accepted in Nature Communications, July 20, 2022.“Tailoring thermalinsulation architectures from additive manufacturing” is accepted in Nature Communications, July 20, 2022.

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“Low-power anisotropic molecular electronic memristors” is accepted in Applied Materials Today, June 17, 2022.“Low-power anisotropic molecular electronic memristors” is accepted in Applied Materials Today, June 17, 2022.

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“Switching charge states in quasi-2D molecular conductors” is published in PNAS Nexus, June 13, 2022.“Switching charge states in quasi-2D molecular conductors” is published in PNAS Nexus, June 13, 2022.

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