“Molecular Copper Decomposition ink for Printable Electronics” is accepted in Chemical Communications, July 21, 2022. July 22, 2022July 22, 2022| Yulong | 0 Comment| 2:14 am Categories: Uncategorized Post navigation Previous Previous post: Next Next post: Related Posts “Solution-shearing of dielectric polymer with high thermal conductivity and electric insulation” is accepted in Science Advances, September 29, 2021. ... Read MoreRead More “A 3D printed molecular ferroelectric metamaterial.” is accepted for publication in Proceedings of the National Academy of Sciences, October, 2020. ... Read MoreRead More “Emerging Magnetic Interactions in van der Waals Heterostructures.” is accepted for publication in Nano Letters, October, 2020. ... Read MoreRead More