“Molecular Copper Decomposition ink for Printable Electronics” is accepted in Chemical Communications, July 21, 2022. July 22, 2022July 22, 2022| Yulong | 0 Comment| 2:14 am Categories: Uncategorized Post navigation Previous Previous post: Next Next post: Related Posts Yong Hu receives the Chinese Government Award for Outstanding Self-Financed Students Abroad Mr. Yong Hu, a Ph.D. candidate, was awarded the prestigious 2020 Chinese Government Award for Outstanding Self-financed Students Abroad from... Read MoreRead More “High Temperature Copper-Graphene Conductors via Aerosol Jetting” is published in Advanced Engineering Materials, March 25. 2022. ... Read MoreRead More “Chemical tuning Meets Two-Dimensional Molecular Magnets”, accepted by Advanced Materials, Nov. 6, 2022. ... Read MoreRead More