REN LAB Uncategorized “Molecular Copper Decomposition ink for Printable Electronics” is accepted in Chemical Communications, July 21, 2022.

“Molecular Copper Decomposition ink for Printable Electronics” is accepted in Chemical Communications, July 21, 2022.

July 22, 2022July 22, 2022 Yulong 0 Comment
Categories:

Related Posts

* “REN Group Featured on ACS Nano and Youtube”

...

Read MoreRead More

“Scalable and robust silica aerogel materials from ambient pressure drying” is published in Materials Advances, January 27, 2022.

...

Read MoreRead More

* “Polymeric Nanoferronics” accepted for publication by the open access of Science journal. Congratulations to Beibei!

http://advances.sciencemag.org/content/1/11/e1501264.abstract  ...

Read MoreRead More