
The REN group works on the forefront of material science, engineering and nanotechnology, including materials-by-design, synthesis and processing, self-assembly, and advanced manufacturing of multifunctional materials with an emphasis on novel magnetic, electronic, optical, thermal and mechanical properties for emerging nanotechnologies. We are committed to realizing our vision by focusing on three main thrusts: (1) Materials design and assembly of strongly correlated electronic crystals for unusual magnetic, electronic and ferroic properties; (2) Lightweight bioinspired materials with thermal management – Superinsulation ceramic aerogels, and Thermally conductive polymers; (3) High-temperature printable materials and manufacturing of flexible hybrid electronics for use in extreme environments; (4) High energy product magnets and metal alloy conversion.
News
- ”Stretchable Copper-Nanocellulose Paper Heater”accepted by Applied Materials Today, Jan 16, 2023 January 17, 2023
- “High-temperature oxidation-resistant printed copper conductors”accepted by Advanced Electronic Materials, Dec. 7 2022, December 8, 2022
- “Controlled growth and chemical engineering of FeSe-based superconducting films”, accepted by Advanced Physics Research, Nov. 24, 2022. November 28, 2022
- ”Flexible Percolation Fibrous Thermal Insulating Composite Membrane for Thermal Management” accepted by Materials Advances, Nov. 23, 2022 November 23, 2022
- “Chemical tuning Meets Two-Dimensional Molecular Magnets”, accepted by Advanced Materials, Nov. 6, 2022. November 15, 2022
- “Molecular magneto-ionic proton sensor in solid-state proton battery” accepted by Nature Communications, Nov. 10 2022 November 11, 2022
- “Creation of Hollow Silica – Fiberglass Soft Ceramics for Thermal Insulation”, accepted by Chemical Engineering Journal, Nov. 9, 2022. November 10, 2022
- “Releasing Chemical Energy in Spatially Programmed Ferroelectrics”, accepted by Nature Communications, Nov. 9, 2022. November 10, 2022
- “Surface passivated Cu conductors for high temperature sulfurous environment”, accepted by Nanoscale Advances, October 22, 2022. October 22, 2022
- “Conformal Cu-CuNi Thermocouple using Particle-Free Ink Materials”, accepted by ACS Applied Electronic Materials, October 20, 2022. October 22, 2022