“Hierarchical Thermal-Conductive Polymer Nanocomposites for Thermal Management” accepted by Applied Materials Today, June 21, 2023 June 22, 2023June 22, 2023 Zheng Li 0 Comment Categories: Uncategorized Post navigation Previous Previous post: Next Next post: Related Posts “High-Temperature Hybridized Copper-Boron Nitride Materials from Additive Manufacturing”, accepted by Advanced Engineering Materials, September 20, 2022. ... Read MoreRead More “A 3D printed molecular ferroelectric metamaterial.” is accepted for publication in Proceedings of the National Academy of Sciences, October, 2020. ... Read MoreRead More “ Printing Air-Stable High-Tc Molecular Magnet with Tunable Magnetic Interaction.” is published in Nano Letters, January 4, 2022. ... Read MoreRead More