“Hierarchical Thermal-Conductive Polymer Nanocomposites for Thermal Management” accepted by Applied Materials Today, June 21, 2023 June 22, 2023June 22, 2023| Zheng Li | 0 Comment| 2:58 am Categories: Uncategorized Post navigation Previous Previous post: Next Next post: Related Posts Abdullah Islam receives the Deans Undergraduate Achievement Award, Undergraduate Researcher Award, and Zimmer Research Scholar Award Abdullah Islam receives the Deans Undergraduate Achievement Award, Undergraduate Researcher Award, and Zimmer Research Scholar Award... Read MoreRead More “Printing Nanostructured Copper for Electromagnetic Interference Shielding” is published in ACS Applied Electronic Materials, March 25. 2022. ... Read MoreRead More “High-temperature oxidation-resistant printed copper conductors”accepted by Advanced Electronic Materials, Dec. 7 2022, ... Read MoreRead More