“Conformal Cu-CuNi Thermocouple using Particle-Free Ink Materials”, accepted by ACS Applied Electronic Materials, October 20, 2022.“Conformal Cu-CuNi Thermocouple using Particle-Free Ink Materials”, accepted by ACS Applied Electronic Materials, October 20, 2022. Read MoreRead More
“High-Temperature Hybridized Copper-Boron Nitride Materials from Additive Manufacturing”, accepted by Advanced Engineering Materials, September 20, 2022.“High-Temperature Hybridized Copper-Boron Nitride Materials from Additive Manufacturing”, accepted by Advanced Engineering Materials, September 20, 2022. Read MoreRead More
“Transparent thermal insulation ceramic aerogel materials for solar thermal conversion”, accepted by Nanoscale Advances, September 1, 2022.“Transparent thermal insulation ceramic aerogel materials for solar thermal conversion”, accepted by Nanoscale Advances, September 1, 2022. Read MoreRead More
“3D-Printed Electrically Conductive Silicon Carbide”, accepted by Additive Manufacturing Journal, August 24, 2022.“3D-Printed Electrically Conductive Silicon Carbide”, accepted by Additive Manufacturing Journal, August 24, 2022. Read MoreRead More
“Dimensional transformation of molecular magnetic materials” is accepted in ACS Nano, August 4, 2022.“Dimensional transformation of molecular magnetic materials” is accepted in ACS Nano, August 4, 2022. Read MoreRead More
“Molecular Copper Decomposition ink for Printable Electronics” is accepted in Chemical Communications, July 21, 2022.“Molecular Copper Decomposition ink for Printable Electronics” is accepted in Chemical Communications, July 21, 2022. Read MoreRead More
“Manufacturing Silica Aerogel and Cryogel through Ambient Pressure and Freeze Drying” is accepted in RSC Advances, July 21, 2022.“Manufacturing Silica Aerogel and Cryogel through Ambient Pressure and Freeze Drying” is accepted in RSC Advances, July 21, 2022. Read MoreRead More
“Tailoring thermalinsulation architectures from additive manufacturing” is accepted in Nature Communications, July 20, 2022.“Tailoring thermalinsulation architectures from additive manufacturing” is accepted in Nature Communications, July 20, 2022. Read MoreRead More
“Low-power anisotropic molecular electronic memristors” is accepted in Applied Materials Today, June 17, 2022.“Low-power anisotropic molecular electronic memristors” is accepted in Applied Materials Today, June 17, 2022. Read MoreRead More
“Switching charge states in quasi-2D molecular conductors” is published in PNAS Nexus, June 13, 2022.“Switching charge states in quasi-2D molecular conductors” is published in PNAS Nexus, June 13, 2022. Read MoreRead More