REN LAB Uncategorized “High-Temperature Hybridized Copper-Boron Nitride Materials from Additive Manufacturing”, accepted by Advanced Engineering Materials, September 20, 2022.

“High-Temperature Hybridized Copper-Boron Nitride Materials from Additive Manufacturing”, accepted by Advanced Engineering Materials, September 20, 2022.

September 21, 2022 Zheng Li 0 Comment

Categories:

Uncategorized

“High-Temperature Hybridized Copper-Boron Nitride Materials from Additive Manufacturing”, accepted by Advanced Engineering Materials, September 20, 2022.

Related Posts

“Copper Nanoplates for Printing Flexible High-Temperature Conductor” is published in ACS Applied Nano Materials, February 18, 2022.

* “Poly(P-Phenylene Terephthalamide) Fibers Reinforced With Ultrathin Ceramic Coatings“ accepted for the publication by Advanced Engineering Materials, April 2018.

“Biogenic Straw Aerogel Thermal Insulation Materials” accepted by Advanced Eenineering Materials, March 20, 2023