”Flexible Percolation Fibrous Thermal Insulating Composite Membrane for Thermal Management” accepted by Materials Advances, Nov. 23, 2022”Flexible Percolation Fibrous Thermal Insulating Composite Membrane for Thermal Management” accepted by Materials Advances, Nov. 23, 2022 November 23, 2022November 23, 2022| 0 Comment| 3:07 pm Read MoreRead More
“Chemical tuning Meets Two-Dimensional Molecular Magnets”, accepted by Advanced Materials, Nov. 6, 2022.“Chemical tuning Meets Two-Dimensional Molecular Magnets”, accepted by Advanced Materials, Nov. 6, 2022. November 15, 2022November 15, 2022| 0 Comment| 2:29 am Read MoreRead More
“Molecular magneto-ionic proton sensor in solid-state proton battery” accepted by Nature Communications, Nov. 10 2022“Molecular magneto-ionic proton sensor in solid-state proton battery” accepted by Nature Communications, Nov. 10 2022 November 11, 2022November 11, 2022| 0 Comment| 3:12 am Read MoreRead More
“Creation of Hollow Silica – Fiberglass Soft Ceramics for Thermal Insulation”, accepted by Chemical Engineering Journal, Nov. 9, 2022.“Creation of Hollow Silica – Fiberglass Soft Ceramics for Thermal Insulation”, accepted by Chemical Engineering Journal, Nov. 9, 2022. November 10, 2022November 10, 2022| 0 Comment| 2:32 am Read MoreRead More
“Releasing Chemical Energy in Spatially Programmed Ferroelectrics”, accepted by Nature Communications, Nov. 9, 2022.“Releasing Chemical Energy in Spatially Programmed Ferroelectrics”, accepted by Nature Communications, Nov. 9, 2022. November 10, 2022November 10, 2022| 0 Comment| 2:31 am Read MoreRead More
“Surface passivated Cu conductors for high temperature sulfurous environment”, accepted by Nanoscale Advances, October 22, 2022.“Surface passivated Cu conductors for high temperature sulfurous environment”, accepted by Nanoscale Advances, October 22, 2022. October 22, 2022October 22, 2022| 0 Comment| 8:49 pm Read MoreRead More
“Conformal Cu-CuNi Thermocouple using Particle-Free Ink Materials”, accepted by ACS Applied Electronic Materials, October 20, 2022.“Conformal Cu-CuNi Thermocouple using Particle-Free Ink Materials”, accepted by ACS Applied Electronic Materials, October 20, 2022. October 22, 2022October 22, 2022| 0 Comment| 8:48 pm Read MoreRead More
“High-Temperature Hybridized Copper-Boron Nitride Materials from Additive Manufacturing”, accepted by Advanced Engineering Materials, September 20, 2022.“High-Temperature Hybridized Copper-Boron Nitride Materials from Additive Manufacturing”, accepted by Advanced Engineering Materials, September 20, 2022. September 21, 2022September 21, 2022| 0 Comment| 2:14 am Read MoreRead More
“Transparent thermal insulation ceramic aerogel materials for solar thermal conversion”, accepted by Nanoscale Advances, September 1, 2022.“Transparent thermal insulation ceramic aerogel materials for solar thermal conversion”, accepted by Nanoscale Advances, September 1, 2022. September 1, 2022September 1, 2022| 0 Comment| 1:38 pm Read MoreRead More
“3D-Printed Electrically Conductive Silicon Carbide”, accepted by Additive Manufacturing Journal, August 24, 2022.“3D-Printed Electrically Conductive Silicon Carbide”, accepted by Additive Manufacturing Journal, August 24, 2022. August 24, 2022August 24, 2022| 0 Comment| 9:12 pm Read MoreRead More