“High-temperature oxidation-resistant printed copper conductors”accepted by Advanced Electronic Materials, Dec. 7 2022, December 8, 2022December 8, 2022| Zheng Li | 0 Comment| 2:47 am Categories: Uncategorized Post navigation Previous Previous post: Next Next post: Related Posts “The transparent thermal insulation silica aerogel.” is accepted for publication in Nanoscale Advances, 2020. ... Read MoreRead More “Controlled growth and chemical engineering of FeSe-based superconducting films”, accepted by Advanced Physics Research, Nov. 24, 2022. ... Read MoreRead More “Copper Nanoplates for Printing Flexible High-Temperature Conductor” is published in ACS Applied Nano Materials, February 18, 2022. ... Read MoreRead More