“Conformal Cu-CuNi Thermocouple using Particle-Free Ink Materials”, accepted by ACS Applied Electronic Materials, October 20, 2022. October 22, 2022October 22, 2022| Zheng Li | 0 Comment| 8:48 pm Categories: Uncategorized Post navigation Previous Previous post: Next Next post: Related Posts “Pressure-controlled magnetism in 2D molecular layers” accepted by Nature Communications, June 2, 2023 ... Read MoreRead More “Cross-Linking and Charging Molecular Magnetoelectronics.” is published in Nano Letters, April 22, 2021. ... Read MoreRead More “High temperature ceramic thermal insulation material” is published in Nano Research, February 14, 2022. ... Read MoreRead More