“Conformal Cu-CuNi Thermocouple using Particle-Free Ink Materials”, accepted by ACS Applied Electronic Materials, October 20, 2022. October 22, 2022October 22, 2022| Zheng Li | 0 Comment| 8:48 pm Categories: Uncategorized Post navigation Previous Previous post: Next Next post: Related Posts * “Metal-Redox for magnetically hard MnBi nanocrystals” Published by Chemistry of Materials “Metal-Redox nanomanufacturing for magnetically hard MnBi nanocrystals” Published by Chemistry of Materials: http://pubs.acs.org/doi/full/10.1021/acs.chemmater.5b01224... Read MoreRead More * “REN Group Featured on ACS Nano and Youtube” ... Read MoreRead More “Tailoring thermalinsulation architectures from additive manufacturing” is accepted in Nature Communications, July 20, 2022. ... Read MoreRead More