“Molecular Copper Decomposition ink for Printable Electronics” is accepted in Chemical Communications, July 21, 2022. July 22, 2022July 22, 2022| Yulong | 0 Comment| 2:14 am Categories: Uncategorized Post navigation Previous Previous post: Next Next post: Related Posts * “Three-Dimensional Directed Assembly of Organic Charge-Transfer Heterostructures” is accepted for publication in Nanosacle, Congratulations to Lin! Dec. 2018 ... Read MoreRead More * Highlight article in “Colloidal Excimer” accepted in Angew. Chem. Int. Ed. ! Congratulations to Zhuolei! The invited highlight article in “Colloidal Excimer” is accepted in Angew. Chem. Int. Ed. ! Congratulations to Zhuolei!... Read MoreRead More * “Poly(P-Phenylene Terephthalamide) Fibers Reinforced With Ultrathin Ceramic Coatings“ accepted for the publication by Advanced Engineering Materials, April 2018. ... Read MoreRead More