“Molecular Copper Decomposition ink for Printable Electronics” is accepted in Chemical Communications, July 21, 2022.

* “Three-Dimensional Directed Assembly of Organic Charge-Transfer Heterostructures” is accepted for publication in Nanosacle, Congratulations to Lin! Dec. 2018

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“The transparent thermal insulation silica aerogel.” is accepted for publication in Nanoscale Advances, 2020.

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* Dr. Ren Receives NSF-CAREER Award

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