“Conformal Cu-CuNi Thermocouple using Particle-Free Ink Materials”, accepted by ACS Applied Electronic Materials, October 20, 2022. October 22, 2022October 22, 2022 Zheng Li 0 Comment Categories: Uncategorized Post navigation Previous Previous post: Next Next post: Related Posts Yong Hu received the 1st Place award in the 2021 Materials Research Society (MRS) Science as Art Competition. ... Read MoreRead More “Controlled growth and chemical engineering of FeSe-based superconducting films”, accepted by Advanced Physics Research, Nov. 24, 2022. ... Read MoreRead More * “Light-induced dilation in nano-sheets of charge transfer complexes“ accepted for the publication by Proceedings of the National Academy of Sciences, March 2018. ... Read MoreRead More