“Conformal Cu-CuNi Thermocouple using Particle-Free Ink Materials”, accepted by ACS Applied Electronic Materials, October 20, 2022. October 22, 2022October 22, 2022| Zheng Li | 0 Comment| 8:48 pm Categories: Uncategorized Post navigation Previous Previous post: Next Next post: Related Posts * “Poly(P-Phenylene Terephthalamide) Fibers Reinforced With Ultrathin Ceramic Coatings“ accepted for the publication by Advanced Engineering Materials, April 2018. ... Read MoreRead More “Dimensional transformation of molecular magnetic materials” is accepted in ACS Nano, August 4, 2022. ... Read MoreRead More “The transparent thermal insulation silica aerogel.” is accepted for publication in Nanoscale Advances, 2020. ... Read MoreRead More