“Molecular Copper Decomposition ink for Printable Electronics” is accepted in Chemical Communications, July 21, 2022. July 22, 2022July 22, 2022 Yulong 0 Comment Categories: Uncategorized Post navigation Previous Previous post: Next Next post: Related Posts “Conformal Cu-CuNi Thermocouple using Particle-Free Ink Materials”, accepted by ACS Applied Electronic Materials, October 20, 2022. ... Read MoreRead More “Printed copper-nanoplate conductor for electro-magnetic interference.” is published in Nanotechnology, December 7, 2021. ... Read MoreRead More * “Self-Assembled Multiferroic Charge-Transfer Crystal” Accepted for Publication at ACS Nano “Self-Assembled Multiferroic CT Crystal” Accepted for Publication at ACS Nano, August 8th, 2015... Read MoreRead More