“Printing Nanostructured Copper for Electromagnetic Interference Shielding” is published in ACS Applied Electronic Materials, March 25. 2022. March 25, 2022March 25, 2022| Yong Hu | 0 Comment| 7:16 pm Categories: Uncategorized Post navigation Previous Previous post: Next Next post: Related Posts * REN Laboratory Moved to Temple University Renewable and Emerging Nanomaterials (REN) Group moved from KU to Temple University: Our lab is located at SERC Room 017, 1947 North 12th... Read MoreRead More * Highlight article in “Colloidal Excimer” accepted in Angew. Chem. Int. Ed. ! Congratulations to Zhuolei! The invited highlight article in “Colloidal Excimer” is accepted in Angew. Chem. Int. Ed. ! Congratulations to Zhuolei!... Read MoreRead More Producing a Happy Wedded life Feel Like Magic – Help and advice For Girlfriends or wives Do you want to know how to have a happy married life? Are you having problems managing your relationship and... Read MoreRead More