“Flexible Copper Nanowire Electronics for Wireless Dynamic Pressure Sensing.” is published in ACS Appl. Electron. Mater., November 22, 2021. November 30, 2021November 30, 2021| Yong Hu | 0 Comment| 1:27 am Categories: Uncategorized Post navigation Previous Previous post: Next Next post: Related Posts * “Three-Dimensional Directed Assembly of Organic Charge-Transfer Heterostructures” is accepted for publication in Nanosacle, Congratulations to Lin! Dec. 2018 ... Read MoreRead More “Manufacturing Silica Aerogel and Cryogel through Ambient Pressure and Freeze Drying” is accepted in RSC Advances, July 21, 2022. ... Read MoreRead More * “This 2-D nanosheet expands like a Grow Monster” on UB News, April 18, 2018 http://www.buffalo.edu/news/releases/2018/04/029.html... Read MoreRead More