“Flexible Copper–Graphene Nanoplates on Ceramic Supports for Radiofrequency Electronics with Electromagnetic Interference Shielding and Thermal Management Capacity.” is accepted in ACS Appl. Nano Mater., September 29, 2021. October 25, 2021October 25, 2021 0 Comment Post navigation Previous Previous post: Next Next post: Related Posts Yong Hu receives the Chinese Government Award for Outstanding Self-Financed Students Abroad Mr. Yong Hu, a Ph.D. candidate, was awarded the prestigious 2020 Chinese Government Award for Outstanding Self-financed Students Abroad from... Read MoreRead More “High temperature ceramic thermal insulation material” is published in Nano Research, February 14, 2022. ... Read MoreRead More “High Temperature Copper-Graphene Conductors via Aerosol Jetting” is published in Advanced Engineering Materials, March 25. 2022. ... Read MoreRead More