“Flexible Copper–Graphene Nanoplates on Ceramic Supports for Radiofrequency Electronics with Electromagnetic Interference Shielding and Thermal Management Capacity.” is accepted in ACS Appl. Nano Mater., September 29, 2021. October 25, 2021October 25, 2021| Yong Hu | 0 Comment| 5:36 pm Categories: Uncategorized Post navigation Previous Previous post: Next Next post: Related Posts “Additive manufacturing of eco-friendly building insulation materials by recycling pulp and paper” accepted by Nanoscale Advances, April 6, 2023 ... Read MoreRead More “ Printing Air-Stable High-Tc Molecular Magnet with Tunable Magnetic Interaction.” is published in Nano Letters, January 4, 2022. ... Read MoreRead More * REN Laboratory Moved to Temple University Renewable and Emerging Nanomaterials (REN) Group moved from KU to Temple University: Our lab is located at SERC Room 017, 1947 North 12th... Read MoreRead More