“Hierarchical Thermal-Conductive Polymer Nanocomposites for Thermal Management” accepted by Applied Materials Today, June 21, 2023 June 22, 2023June 22, 2023| Zheng Li | 0 Comment| 2:58 am Categories: Uncategorized Post navigation Previous Previous post: Next Next post: Related Posts “3D-Printed Electrically Conductive Silicon Carbide”, accepted by Additive Manufacturing Journal, August 24, 2022. ... Read MoreRead More “Emerging Magnetic Interactions in van der Waals Heterostructures.” is accepted for publication in Nano Letters, October, 2020. ... Read MoreRead More “Flexible Copper–Graphene Nanoplates on Ceramic Supports for Radiofrequency Electronics with Electromagnetic Interference Shielding and Thermal Management Capacity.” is accepted in ACS Appl. Nano Mater., September 29, 2021. ... Read MoreRead More