REN LABUncategorized “Copper Nanoplates for Printing Flexible High-Temperature Conductor” is published in ACS Applied Nano Materials, February 18, 2022.
“Copper Nanoplates for Printing Flexible High-Temperature Conductor” is published in ACS Applied Nano Materials, February 18, 2022.
* “Three-Dimensional Directed Assembly of Organic Charge-Transfer Heterostructures” is accepted for publication in Nanosacle, Congratulations to Lin! Dec. 2018